TRI and Bosch develop AI solution for MEMS packaging

MEMS packaging is an essential process for protecting the delicate parts of MEMS devices and facilitating their integration with electronic circuits. The devlopment of the AI visual check solution for this purpose demonstrates how companies are approaching the specific requirements of MEMS packaging, including safeguarding MEMS from environmental damage and stress.

Bosch has recognised TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration reflects TRI's experience in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.